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中心组成工作组开发芯片,缓解海关问题
“有必要开发大容量电信产品芯片利用电信技术发展基金(TTDF)和其他资金支持的电子和它,“电信部门(点)周一在一份通知中说,他补充说,实现Atmanirbharta(自力更生)在发展电信芯片组,工作组已经构成。
开发接近的行业高管之间的高层对话与部长沟通,它和铁路Ashwini Vaishnaw本月初,审查根据激励方案下的进步。
“有必要开发大容量电信产品芯片利用电信技术发展基金(TTDF)和其他资金支持的电子和它,“电信部门(点)周一在一份通知中说,他补充说,实现Atmanirbharta(自力更生)在发展电信芯片组,工作组已经构成。
指定的部门光辉的网络总裁桑杰Nayak作为项目组负责人和成员如基肖尔先生、副总经理Standards-R&D-Innovation (SRI)点和Amitesh Kumar Sinha临时首席执行官印度半导体的使命。
的主持下远程信息处理中心的发展(C-DoT) RK Upadhayay,国有电信技术研发公司,专责小组建立一个弹性组件生态系统为电信和电子制造业已经成立。
首席执行官的面板还包括普拉卡什Tulsiani孟买机场和Christioh Schnellmann,首席执行官Jewar机场,将主要审查目前的生态系统,和电子制造业供需的组件,并分阶段电信设备制造业战略至关重要的。
“PLI受益人提出问题面临的采购半导体和其他组件由于全球短缺。这导致高铅时间,更高的库存投资。公司还强调,全球经销商在印度没有仓库,”部门补充道。
中心推荐Jewar机场仓储区对制造商减少交货时间在国家首都地区(NCR)采购组件。
普及利维收集近5年来在Rs 41740 cr:金属氧化物半导体电信
“在2017 - 18 - 2021 - 22(过去五年)Rs。41740卢比,已经收集了普及利维(UAL)普遍服务义务基金的Rs。30213卢比支付从USOF说期间,”部长说。
与此同时,印度铁路已经连接港口与印度古吉拉特邦加速运输的组件部署在电信基础设施的关键。
工作组在电信和电子设备空间探索新的机会与第五代或5 g的出现,也被建立在前点顾问RK博。
本土公司所面临的挑战后,中心旨在促进国内制造业促进缓解与有形的做生意的结果。
几个政府主导的项目如雄心勃勃的第四代(4 g)推出Bharat Sanchar Nigam说有限(BSNL)和5 g电信网络部署和扩展的电信服务提供商有碰壁后供应链的约束导致的服务质量(QoS)的问题。
钢片琴眼睛资本投资于印度的半导体行业
“任何国家半导体是一个非常重要的行业。今天是地缘政治的中心舞台。风险投资家可能希望更多的让步,政府应该确保如果他们把钱从美国,它可以成倍增加,并且能够把它带回自己的国家,“AJ Paulraj,钢片琴资本合资企业合伙人,斯坦福大学名誉教授告诉ETTelecom。乐动娱乐招聘
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<\/figure>NEW DELHI: The Department of Telecommunications<\/a> (DoT<\/a>) constituted multi-member task forces primarily for the development of high-volume chipsets, ensuring components ecosystem, and overcoming supply chain challenges.The development comes close on the heels of a high-level dialogue between top industry executives with Minister of Communications, IT and Railways Ashwini Vaishnaw early this month, to review the progress under the production-linked incentive scheme.
\"There is a need to develop high-volume telcom chipset utilising telecom technology development fund (TTDF) and other funding support from the Ministry of Electronics and IT,\" the telecom department (DoT) in a notification Monday said, adding that for achieving Atmanirbharta (self reliance) in telecom chipset development, a task force has been constituted.
<\/div><\/div>The 12-member task force will study the potential high-volume chipset required by telecom equipment manufacturing companies, as well as map local demand and requirements worldwide, and recommend a few potential companies to obtain benefit from the TTDF and semiconductor policy<\/a>.
The department named Tejas Networks<\/a> managing director Sanjay Nayak as the task force head with members such as Kishore Babu, deputy director general, Standards-R&D-Innovation (SRI) at DoT and Amitesh Kumar Sinha, interim chief executive of India Semiconductor Mission.
Under the chairmanship of Centre of Development of Telematics<\/a> (C-DoT) RK Upadhayay, a state-run telecom technology R&D firm, a task force to build a resilient components ecosystem for telecom and electronics manufacturing has been set up.
The panel that also included Prakash Tulsiani, chief executive of Mumbai Airport and Christioh Schnellmann, chief executive of Jewar Airport, would primarily review the present ecosystem, and demand and supply of components for electronics manufacturing, and phased manufacturing strategy for critical telecom equipment.
\"The PLI beneficiaries raised problems being faced in sourcing the semiconductor and other components due to global shortage. This results in high lead time, higher investment in inventory. The companies also highlighted that the global distributors have no warehouses in India,\" the department added.
The department named Tejas Networks<\/a> managing director Sanjay Nayak as the task force head with members such as Kishore Babu, deputy director general, Standards-R&D-Innovation (SRI) at DoT and Amitesh Kumar Sinha, interim chief executive of India Semiconductor Mission.
Under the chairmanship of Centre of Development of Telematics<\/a> (C-DoT) RK Upadhayay, a state-run telecom technology R&D firm, a task force to build a resilient components ecosystem for telecom and electronics manufacturing has been set up.
The panel that also included Prakash Tulsiani, chief executive of Mumbai Airport and Christioh Schnellmann, chief executive of Jewar Airport, would primarily review the present ecosystem, and demand and supply of components for electronics manufacturing, and phased manufacturing strategy for critical telecom equipment.
\"The PLI beneficiaries raised problems being faced in sourcing the semiconductor and other components due to global shortage. This results in high lead time, higher investment in inventory. The companies also highlighted that the global distributors have no warehouses in India,\" the department added.
<\/div><\/div>In order to ease existing supply chain issues, the government also formed a task force under VVDN Technologies<\/a> chief executive Puneet Agarwal to facilitate availability of components, including studies on port operations, turnaround time of cargo shipments, infrastructure readiness at railroads, seaports and airports, and setting up of free trade warehousing zones (FTWZ) at a few airports.
The Centre recommended a warehousing zone at Jewar airport to reduce the lead time for manufacturers in the national capital region (NCR) for procuring components.
The Centre recommended a warehousing zone at Jewar airport to reduce the lead time for manufacturers in the national capital region (NCR) for procuring components.