The government will review norms of the design linked incentive<\/a> (DLI) program which envisages to support 100 companies involved in product design in the semiconductor space as part of a Rs 76,000 crore scheme for developing the electronic chip<\/a> ecosystem in the country, Minister of State for Electronics and IT Rajeev Chandrasekhar<\/a> said on Sunday. He also said the scheme will continue to be in place to support all product design projects and start-ups, among others. “DLI规范是否需要修改…我们从这次会议,也许有一些反馈DLI设计非常狭窄。也许有上限限制太多资金。我们将检查所有,”钱德拉塞卡告诉记者。 政府将审查的规范设计与激励(DLI)计划的设想,以支持100家公司参与产品设计在半导体领域的76000卢比方案发展电子芯片生态系统,电子和部长拉杰夫钱德拉塞卡周日表示。他还表示,该计划将继续来支持所有产品设计项目和创业公司,等等。
\"Whether the DLI norms need to be modified... We have got some feedback from this conference that maybe the DLI has been designed to be very narrow. Maybe there is a cap on funding that is too restrictive. We will examine all that,\" Chandrasekhar told reporters.
He was addressing the media at the Semicon India 2022 conference after seven memorandums of understanding (MoUs) were signed between government organisations and technology companies.
\"I want to say this very clearly that the USD 10 million package of the Rs 76,000 crore package is for the ecosystem and design and innovation is a very important part of the ecosystem. Talent is a very important part of the ecosystem. There is a need to sort of redesign some of those pieces, we will do it,\" Chandrasekhar said.
The scheme provides for reimbursement of up to Rs 30 lakh per application for MPW (multi-project wafer) fabrication of design and post-silicon validation activities; reimbursement of up to 50 per cent of the eligible expenditure subject to a ceiling of Rs 15 crore per application for designing semiconductor goods; and reimbursement of 6 to 4 per cent of net sales of designed semiconductor goods over 5 years subject to a ceiling of Rs 30 crore.
At the event, the Ministry of Electronics and IT announced the onboarding of Prof Rao Tummala from Georgia Tech University, US, on the Advisory Committee of India Semiconductor Mission.
MoUs were signed between Cyient, WiSig Networks and IIT Hyderabad to enable mass production of \"5G Narrowband-IoT- the Koala Chip, Architected and Designed in India\".
Signalchip Innovations, Ministry of Electronics and IT (MeitY) and the Centre for Development of Advanced Computing (C-DAC) signed an agreement for not only design and manufacture but also deployment and maintenance of 10 lakh Integrated NavIC (Navigation with Indian Constellation) and GPS Receivers.
State-run CDAC announced partnership with Synopsys, Cadence Design Systems, Siemens<\/a> EDA and Silvaco for making available their Electronic Design Automation (EDA) tools and design solutions for Chips to Startup (C2S) Programme being implemented by CDAC.
Chips to Startup (C2S) Programme of MeitY aims to create 85,000 specialised engineers at B Tech, M Tech and PhD levels for expanding Indian semiconductor talent at over 100 institutions across the country.
Besides, Semiconductor Research Corporation (SRC) USA and IIT Bombay will focus on bringing together SRC's industry experts and India's R&D talent to create an industry driven research and development program.<\/p><\/body>","next_sibling":[{"msid":91232592,"title":"Chip consortium ISMC to set up $3 billion plant in India's Karnataka","entity_type":"ARTICLE","link":"\/news\/chip-consortium-ismc-to-set-up-3-billion-plant-in-indias-karnataka\/91232592","category_name":null,"category_name_seo":"telecomnews"}],"related_content":[{"msid":"91233265","title":"New Delhi: Minister of State for Skill Development and Entrepreneurship Rajeev C...","entity_type":"IMAGES","seopath":"news\/economy\/policy\/govt-to-review-design-linked-incentive-scheme-mos-it-rajeev-chandrasekhar\/new-delhi-minister-of-state-for-skill-development-and-entrepreneurship-rajeev-c-","category_name":"Govt to review design linked incentive scheme: MoS IT Rajeev Chandrasekhar","synopsis":"Minister of State for Skill Development and Entrepreneurship Rajeev Chandrasekhar.","thumb":"https:\/\/etimg.etb2bimg.com\/thumb\/img-size-155906\/91233265.cms?width=150&height=112","link":"\/image\/economy\/policy\/govt-to-review-design-linked-incentive-scheme-mos-it-rajeev-chandrasekhar\/new-delhi-minister-of-state-for-skill-development-and-entrepreneurship-rajeev-c-\/91233265"}],"msid":91233567,"entity_type":"ARTICLE","title":"Govt to review design linked incentive scheme: MoS IT Rajeev Chandrasekhar","synopsis":"\"Whether the DLI norms need to be modified... We have got some feedback from this conference that maybe the DLI has been designed to be very narrow. Maybe there is a cap on funding that is too restrictive. We will examine all that,\" Chandrasekhar told reporters.","titleseo":"telecomnews\/govt-to-review-design-linked-incentive-scheme-mos-it-rajeev-chandrasekhar","status":"ACTIVE","authors":[],"analytics":{"comments":0,"views":293,"shares":0,"engagementtimems":1355000},"Alttitle":{"minfo":""},"artag":"PTI","artdate":"2022-05-01 15:41:16","lastupd":"2022-05-01 15:42:21","breadcrumbTags":["design linked incentive","Rajeev Chandrasekhar","mos it","siemens","DLI scheme","electronic chip","Policy"],"secinfo":{"seolocation":"telecomnews\/govt-to-review-design-linked-incentive-scheme-mos-it-rajeev-chandrasekhar"}}" data-authors="[" "]" data-category-name="" data-category_id="" data-date="2022-05-01" data-index="article_1">
政府审查设计与激励方案:MoS Rajeev钱德拉塞卡
“DLI规范是否需要修改…我们从这次会议,也许有一些反馈DLI设计非常狭窄。也许有上限限制太多资金。我们将检查所有,”钱德拉塞卡告诉记者。
“我想说这得很清楚,1000万美元包76000卢比的包是生态系统和设计和创新是一个非常重要的生态系统的一部分。人才是一个非常重要的生态系统的一部分。需要重新设计一些作品,我们将这样做,“钱德拉塞卡说。
方案提供报销的Rs 30十万卢比/申请”(多项目晶片)设计制造和post-silicon验证活动;报销的高达50%的符合条件的支出受的上限15卢比/设计半导体产品申请书;和报销的6 - 4%的净销售额的半导体产品设计5年以上30卢比的上限。
事件,电子和宣布的新员工培训拉奥Tummala乔治亚理工大学的我们,印度半导体咨询委员会的任务。
Cyient之间签署了备忘录,WiSig网络和IIT海德拉巴,使大规模生产的“5 g Narrowband-IoT——考拉芯片,架构和设计在印度”。
Signalchip创新,电子和它(MeitY)和开发先进的计算中心(C-DAC)签署了一项协议不仅设计和制造,而且10十万的部署和维护集成NavIC(导航星座与印度)和GPS接收器。
国营CDAC宣布与Synopsys对此合作,节奏设计系统,西门子EDA和Silvaco提供他们的电子设计自动化(EDA)工具和设计解决方案芯片启动(in)项目被CDAC实现。
芯片启动MeitY (in)项目旨在创造85000个专业工程师B科技,科技和博士学位水平,扩大印度半导体人才在全国超过100家机构。
此外,半导体研究公司(SRC)美国和IIT孟买将集中汇集SRC的业内专家和印度的研发人才,创造一个产业驱动的研究和发展项目。
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The government will review norms of the design linked incentive<\/a> (DLI) program which envisages to support 100 companies involved in product design in the semiconductor space as part of a Rs 76,000 crore scheme for developing the electronic chip<\/a> ecosystem in the country, Minister of State for Electronics and IT Rajeev Chandrasekhar<\/a> said on Sunday. He also said the scheme will continue to be in place to support all product design projects and start-ups, among others.
\"Whether the DLI norms need to be modified... We have got some feedback from this conference that maybe the DLI has been designed to be very narrow. Maybe there is a cap on funding that is too restrictive. We will examine all that,\" Chandrasekhar told reporters.
He was addressing the media at the Semicon India 2022 conference after seven memorandums of understanding (MoUs) were signed between government organisations and technology companies.
\"I want to say this very clearly that the USD 10 million package of the Rs 76,000 crore package is for the ecosystem and design and innovation is a very important part of the ecosystem. Talent is a very important part of the ecosystem. There is a need to sort of redesign some of those pieces, we will do it,\" Chandrasekhar said.
The scheme provides for reimbursement of up to Rs 30 lakh per application for MPW (multi-project wafer) fabrication of design and post-silicon validation activities; reimbursement of up to 50 per cent of the eligible expenditure subject to a ceiling of Rs 15 crore per application for designing semiconductor goods; and reimbursement of 6 to 4 per cent of net sales of designed semiconductor goods over 5 years subject to a ceiling of Rs 30 crore.
At the event, the Ministry of Electronics and IT announced the onboarding of Prof Rao Tummala from Georgia Tech University, US, on the Advisory Committee of India Semiconductor Mission.
MoUs were signed between Cyient, WiSig Networks and IIT Hyderabad to enable mass production of \"5G Narrowband-IoT- the Koala Chip, Architected and Designed in India\".
Signalchip Innovations, Ministry of Electronics and IT (MeitY) and the Centre for Development of Advanced Computing (C-DAC) signed an agreement for not only design and manufacture but also deployment and maintenance of 10 lakh Integrated NavIC (Navigation with Indian Constellation) and GPS Receivers.
State-run CDAC announced partnership with Synopsys, Cadence Design Systems, Siemens<\/a> EDA and Silvaco for making available their Electronic Design Automation (EDA) tools and design solutions for Chips to Startup (C2S) Programme being implemented by CDAC.
Chips to Startup (C2S) Programme of MeitY aims to create 85,000 specialised engineers at B Tech, M Tech and PhD levels for expanding Indian semiconductor talent at over 100 institutions across the country.
Besides, Semiconductor Research Corporation (SRC) USA and IIT Bombay will focus on bringing together SRC's industry experts and India's R&D talent to create an industry driven research and development program.<\/p><\/body>","next_sibling":[{"msid":91232592,"title":"Chip consortium ISMC to set up $3 billion plant in India's Karnataka","entity_type":"ARTICLE","link":"\/news\/chip-consortium-ismc-to-set-up-3-billion-plant-in-indias-karnataka\/91232592","category_name":null,"category_name_seo":"telecomnews"}],"related_content":[{"msid":"91233265","title":"New Delhi: Minister of State for Skill Development and Entrepreneurship Rajeev C...","entity_type":"IMAGES","seopath":"news\/economy\/policy\/govt-to-review-design-linked-incentive-scheme-mos-it-rajeev-chandrasekhar\/new-delhi-minister-of-state-for-skill-development-and-entrepreneurship-rajeev-c-","category_name":"Govt to review design linked incentive scheme: MoS IT Rajeev Chandrasekhar","synopsis":"Minister of State for Skill Development and Entrepreneurship Rajeev Chandrasekhar.","thumb":"https:\/\/etimg.etb2bimg.com\/thumb\/img-size-155906\/91233265.cms?width=150&height=112","link":"\/image\/economy\/policy\/govt-to-review-design-linked-incentive-scheme-mos-it-rajeev-chandrasekhar\/new-delhi-minister-of-state-for-skill-development-and-entrepreneurship-rajeev-c-\/91233265"}],"msid":91233567,"entity_type":"ARTICLE","title":"Govt to review design linked incentive scheme: MoS IT Rajeev Chandrasekhar","synopsis":"\"Whether the DLI norms need to be modified... We have got some feedback from this conference that maybe the DLI has been designed to be very narrow. Maybe there is a cap on funding that is too restrictive. We will examine all that,\" Chandrasekhar told reporters.","titleseo":"telecomnews\/govt-to-review-design-linked-incentive-scheme-mos-it-rajeev-chandrasekhar","status":"ACTIVE","authors":[],"analytics":{"comments":0,"views":293,"shares":0,"engagementtimems":1355000},"Alttitle":{"minfo":""},"artag":"PTI","artdate":"2022-05-01 15:41:16","lastupd":"2022-05-01 15:42:21","breadcrumbTags":["design linked incentive","Rajeev Chandrasekhar","mos it","siemens","DLI scheme","electronic chip","Policy"],"secinfo":{"seolocation":"telecomnews\/govt-to-review-design-linked-incentive-scheme-mos-it-rajeev-chandrasekhar"}}" data-news_link="//www.iser-br.com/news/govt-to-review-design-linked-incentive-scheme-mos-it-rajeev-chandrasekhar/91233567">
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