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IGSSV寻求印度的合作伙伴工厂尝试
IGSSV已经一个谅解备忘录与泰米尔纳德邦政府投资开发机构TIDCO建立半导体工厂在泰米尔纳德邦,但它正在寻找一个“经验丰富的印度mfg /私人实体”熟悉的基础设施和官僚事务
新加坡igs企业(IGSSV),申请人在该中心的100亿美元计划的种子半导体生态系统,保持对话与印度制造实体的伙伴关系在审查其激励应用程序建立一个35亿美元的铸造工厂在印度。
IGSSV已经有一个谅解备忘录泰米尔纳德邦政府投资开发的身体TIDCO构建在泰米尔纳德邦半导体工厂,但它正在寻找一个“经验丰富的印度mfg /私人实体”熟悉的基础设施和官僚事务。
首席执行官Raj Kumar告诉ET,他不愿意猜测铁道部激励批准timelines-expected在十月称将在11月密封与印度合作伙伴的交易。
“我们已经TIDCO作为著名的印度合作伙伴。我们正在努力实现的是梦想与印度最大的私人实体之一,可以帮助我们加快项目Suria,”Kumar告诉等。
预计中国政府将开始授予第一组激励下半导体包在10月或11月初的100亿美元。
IGSSV旨在建立一个工厂被称为半导体的说法是“代工工厂”,一个工厂,生产微芯片等多种用户王智立公司,先进的电子产品制造商,和其他人。半导体的节点,IGSSV的工厂会把28 nm segment-used在智能手机和其他设备和其他几个成熟的节点。IGSSV提议创建一个占地300英亩的公园在泰米尔纳德邦,包括半导体电路设计师,组装和测试的生态系统,材料和设备供应商。
在标准制定的中心,申请人公司应该有了价值7500卢比的收入目标在前三年的任何应用程序提交。
IGSSV也与比利时微电子研究实验室的大学间的微电子中心(IMEC)许可证所需的技术其半导体节点。
中心规定,申请人生产级授权技术,显示和路线图发展成高科技节点通过产品开发或收购的技术。
在其响应等,IGSSV重申站敦促中心坚持其incentive-approval时间表。
9月在谅解备忘录签字仪式与古吉拉特邦政府设立半导体和显示工厂单位,吠檀多主席曾经说过,阿尼尔•阿加瓦尔半导体工厂的奠基仪式预计将会在2 - 3个月。等早前报道,富士康年轻的刘主席的印度访问计划下半年11月。
该中心的半导体印度计划建立在国家半导体的生态系统最近修改的大范围的50%的资本补贴所有categories-semiconductor晶圆厂的板,显示板工厂、化合物半导体、包装工厂,和其他人。
IGSSV已经有一个谅解备忘录泰米尔纳德邦政府投资开发的身体TIDCO构建在泰米尔纳德邦半导体工厂,但它正在寻找一个“经验丰富的印度mfg /私人实体”熟悉的基础设施和官僚事务。
首席执行官Raj Kumar告诉ET,他不愿意猜测铁道部激励批准timelines-expected在十月称将在11月密封与印度合作伙伴的交易。
预计中国政府将开始授予第一组激励下半导体包在10月或11月初的100亿美元。
IGSSV旨在建立一个工厂被称为半导体的说法是“代工工厂”,一个工厂,生产微芯片等多种用户王智立公司,先进的电子产品制造商,和其他人。半导体的节点,IGSSV的工厂会把28 nm segment-used在智能手机和其他设备和其他几个成熟的节点。IGSSV提议创建一个占地300英亩的公园在泰米尔纳德邦,包括半导体电路设计师,组装和测试的生态系统,材料和设备供应商。
在标准制定的中心,申请人公司应该有了价值7500卢比的收入目标在前三年的任何应用程序提交。
半导体:一篇写于1965年的领导人保持芯片在包的前面
摩尔的先见之明讲话以来,每个芯片的晶体管数量已经从100增加到近500亿,同时组件大小变小。简单来说,利率增加了一个零密度每3.5年。
IGSSV也与比利时微电子研究实验室的大学间的微电子中心(IMEC)许可证所需的技术其半导体节点。
在其响应等,IGSSV重申站敦促中心坚持其incentive-approval时间表。
9月在谅解备忘录签字仪式与古吉拉特邦政府设立半导体和显示工厂单位,吠檀多主席曾经说过,阿尼尔•阿加瓦尔半导体工厂的奠基仪式预计将会在2 - 3个月。等早前报道,富士康年轻的刘主席的印度访问计划下半年11月。
该中心的半导体印度计划建立在国家半导体的生态系统最近修改的大范围的50%的资本补贴所有categories-semiconductor晶圆厂的板,显示板工厂、化合物半导体、包装工厂,和其他人。
Singapore-based IGSS Ventures (IGSSV<\/a>), one of the applicants under the Centre's $10 billion scheme to seed a semiconductor<\/a> ecosystem, is holding dialogue with Indian manufacturing entities for partnerships amid scrutiny of its incentive application to build a $3.5 billion foundry fab in India.
IGSSV already has an MoU with Tamil Nadu<\/a> government\u2019s investment development body TIDCO to build a semiconductor plant in Tamil Nadu, but it is looking for an \u201cexperienced Indian mfg\/private entity\u201d familiar with infrastructure and bureaucracy affairs.
CEO Raj Kumar told ET he would not like to speculate on the ministry incentive approval timelines\u2014expected in October\u2014but said it would look to seal the deal with the Indian partner by November.
IGSSV already has an MoU with Tamil Nadu<\/a> government\u2019s investment development body TIDCO to build a semiconductor plant in Tamil Nadu, but it is looking for an \u201cexperienced Indian mfg\/private entity\u201d familiar with infrastructure and bureaucracy affairs.
CEO Raj Kumar told ET he would not like to speculate on the ministry incentive approval timelines\u2014expected in October\u2014but said it would look to seal the deal with the Indian partner by November.
<\/div><\/div>\u201cWe already have TIDCO as a reputable Indian partner. What we are trying to achieve is a dream partnership with one of India's top private entities that can help us accelerate Project Suria,\u201d Kumar told ET.
The government is expected to start awarding the first set of incentives under the $10 billion semiconductor package by October or early November.
IGSSV aims to build a factory dubbed in semiconductor parlance as \u2018foundry fab\u2019, a plant that manufactures microchips for a variety of users like fabless semiconductor companies, advanced electronics manufacturers, and others. In terms of semiconductor nodes, IGSSV\u2019s factory would incorporate the 28 nm segment\u2014used in smartphones and other gadgets\u2014and several other mature nodes. IGSSV has proposed to create a 300-acre park in Tamil Nadu that would include semiconductor circuit designers, assembly and test ecosystems, and material and equipment suppliers.
Among the criteria laid out by the Centre, the applicant company should have crossed a Rs 7,500-crore revenue target in any of the three years preceding application submission.
The government is expected to start awarding the first set of incentives under the $10 billion semiconductor package by October or early November.
IGSSV aims to build a factory dubbed in semiconductor parlance as \u2018foundry fab\u2019, a plant that manufactures microchips for a variety of users like fabless semiconductor companies, advanced electronics manufacturers, and others. In terms of semiconductor nodes, IGSSV\u2019s factory would incorporate the 28 nm segment\u2014used in smartphones and other gadgets\u2014and several other mature nodes. IGSSV has proposed to create a 300-acre park in Tamil Nadu that would include semiconductor circuit designers, assembly and test ecosystems, and material and equipment suppliers.
Among the criteria laid out by the Centre, the applicant company should have crossed a Rs 7,500-crore revenue target in any of the three years preceding application submission.
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