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<\/span><\/figcaption><\/figure>\nBy Stephen Nellis

Lam Research<\/a> Corp on Tuesday released its first major new tool in two decades for producing finer three-dimensional details on computer chips<\/a> that must be shrunk down to fit into ever more complex phones and other electronic devices<\/a>.
The company also committed to boosting its dividends each year and returning more cash to investors.

At an analyst day in New York<\/a>, Lam executives introduced the Sense.i, a tool for etching features on silicon wafers to make chips<\/a>.

In recent years, the intricate patterns on chips have become like the grid of dense urban neighborhood. Chip makers\n have run out of room to pack any more transistors side by side, so they have started building upward.

Crafting those three dimensional features has become key for Lam's memory chip customers such as Samsung Electronics Co<\/a> Ltd and SK Hynix Inc in putting more memory capacity into phones and other devices<\/a>.

Such chips can require etching 1 trillion holes on a silicon wafer, said Vahid Vahedi, senior vice president and general manager of the etch product group at Lam Research<\/a>. Lam specializes in making the holes tall and narrow so more can be packed in the same space. Using the urban neighborhood analogy, the holes would be proportionately as tall and narrow as the Empire State Building stacked on itself more than six times.

Lam executives said memory chip makers will likely be first to adopt the new tool, but computing chipmakers were likely to follow. \"This vertical scaling is a very strong driver of growth for us,\" Vahedi said at the conference.

The company also committed to returning more free cash to shareholders. Previously, Lam had said it planned to commit at least 50% of free cash flow each year to capital return. Since then, the company has exceeded that mark through share buybacks and dividends, thanks in part to changes in U.S. tax laws, said Doug Bettinger, Lam's chief financial officer.

Going forward, Betting said Lam will return 75% to 100% of Lam's free cash flow and will also boost its dividend each year.

\"If you look at the breakdown of the cash return to shareholders, it's been more allocated to buybacks, but given the dividend has grown every year, that's an increasing percentage of the free cash flow return as well, and likely will continue to be over time,\" Bettinger said in an interview.
<\/body>","next_sibling":[{"msid":74472506,"title":"Stock market update: Telecom shares mixed; Punjab Communications zooms 8%","entity_type":"ARTICLE","link":"\/news\/stock-market-update-telecom-shares-mixed-punjab-communications-zooms-8\/74472506","category_name":null,"category_name_seo":"telecomnews"}],"related_content":[],"msid":74472679,"entity_type":"ARTICLE","title":"Lam Research unveils improved tool to make 3-D chips for phones, devices","synopsis":"Lam Research unveils improved tool to make 3-D chips for phones, devices","titleseo":"telecomnews\/lam-research-unveils-improved-tool-to-make-3-d-chips-for-phones-devices","status":"ACTIVE","authors":[],"Alttitle":{"minfo":""},"artag":"Reuters","artdate":"2020-03-04 13:08:27","lastupd":"2020-03-04 13:12:58","breadcrumbTags":["Lam Research","3D","Smartphone","chips","Devices","new york","Samsung Electronics Co"],"secinfo":{"seolocation":"telecomnews\/lam-research-unveils-improved-tool-to-make-3-d-chips-for-phones-devices"}}" data-authors="[" "]" data-category-name="" data-category_id="" data-date="2020-03-04" data-index="article_1">

林研究揭示改进工具为手机制造3 d芯片,设备

林研究揭示改进工具为手机制造3 d芯片,设备

  • 更新2020年3月4日下午01:12坚持
斯蒂芬·内尔尼斯

林的研究. n:行情)周二发布了20年来第一次重大新工具生产更精细的三维电脑的细节芯片必须缩小以适应更加复杂的手机和其他电子设备。
该公司还致力于提高其每年股息并返回更多的现金给投资者。

在分析师的一天纽约林高管介绍了意义。我,一个工具对硅片腐蚀特性芯片。

近年来,复杂的模式等芯片已经成为网格密集的城市社区。芯片制造商已经没有房间并排装任何更多的晶体管,所以他们已经开始建筑向上。

广告
制作的三维特性已成为Lam的内存芯片关键客户等三星电子有限公司有限公司在投入更多的内存容量和SK海力士公司电话和其他设备。

这样的芯片需要蚀刻硅片1万亿个洞,瓦希德Vahedi说,高级副总裁兼总经理蚀刻产品组林的研究。林专业生产洞又高又窄所以更多的可以装在同一个空间。使用城市社区类比,黑洞将比例高,窄如帝国大厦堆放在六倍多。

林高管表示记忆体晶片制造商可能会首先采用新工具,但计算芯片制造商可能效仿。“这垂直扩展对我们来说是一个非常强大的经济增长的主要动力,“Vahedi在会议上说。

该公司还致力于恢复更多的股东自由现金。此前,Lam表示,计划提交每年至少50%的自由现金流资金回报。自那以来,该公司已超过马克通过股票回购和股息,这在一定程度上要归功于美国税法的变化,Doug打赌说,林的首席财务官。

展望未来,赌林会返回75%到100%的Lam表示的自由现金流和每年还将提高股息。

广告
“如果你看看的现金还给股东,这是分配给回购,但考虑到每年股息增长,这是一个增加的百分比自由现金流回报,并可能将继续随着时间的推移,“赌在一个采访中说。
  • 发布于2020年3月4日01:08点坚持

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\"\"
<\/span><\/figcaption><\/figure>\nBy Stephen Nellis

Lam Research<\/a> Corp on Tuesday released its first major new tool in two decades for producing finer three-dimensional details on computer chips<\/a> that must be shrunk down to fit into ever more complex phones and other electronic devices<\/a>.
The company also committed to boosting its dividends each year and returning more cash to investors.

At an analyst day in New York<\/a>, Lam executives introduced the Sense.i, a tool for etching features on silicon wafers to make chips<\/a>.

In recent years, the intricate patterns on chips have become like the grid of dense urban neighborhood. Chip makers\n have run out of room to pack any more transistors side by side, so they have started building upward.

Crafting those three dimensional features has become key for Lam's memory chip customers such as Samsung Electronics Co<\/a> Ltd and SK Hynix Inc in putting more memory capacity into phones and other devices<\/a>.

Such chips can require etching 1 trillion holes on a silicon wafer, said Vahid Vahedi, senior vice president and general manager of the etch product group at Lam Research<\/a>. Lam specializes in making the holes tall and narrow so more can be packed in the same space. Using the urban neighborhood analogy, the holes would be proportionately as tall and narrow as the Empire State Building stacked on itself more than six times.

Lam executives said memory chip makers will likely be first to adopt the new tool, but computing chipmakers were likely to follow. \"This vertical scaling is a very strong driver of growth for us,\" Vahedi said at the conference.

The company also committed to returning more free cash to shareholders. Previously, Lam had said it planned to commit at least 50% of free cash flow each year to capital return. Since then, the company has exceeded that mark through share buybacks and dividends, thanks in part to changes in U.S. tax laws, said Doug Bettinger, Lam's chief financial officer.

Going forward, Betting said Lam will return 75% to 100% of Lam's free cash flow and will also boost its dividend each year.

\"If you look at the breakdown of the cash return to shareholders, it's been more allocated to buybacks, but given the dividend has grown every year, that's an increasing percentage of the free cash flow return as well, and likely will continue to be over time,\" Bettinger said in an interview.
<\/body>","next_sibling":[{"msid":74472506,"title":"Stock market update: Telecom shares mixed; Punjab Communications zooms 8%","entity_type":"ARTICLE","link":"\/news\/stock-market-update-telecom-shares-mixed-punjab-communications-zooms-8\/74472506","category_name":null,"category_name_seo":"telecomnews"}],"related_content":[],"msid":74472679,"entity_type":"ARTICLE","title":"Lam Research unveils improved tool to make 3-D chips for phones, devices","synopsis":"Lam Research unveils improved tool to make 3-D chips for phones, devices","titleseo":"telecomnews\/lam-research-unveils-improved-tool-to-make-3-d-chips-for-phones-devices","status":"ACTIVE","authors":[],"Alttitle":{"minfo":""},"artag":"Reuters","artdate":"2020-03-04 13:08:27","lastupd":"2020-03-04 13:12:58","breadcrumbTags":["Lam Research","3D","Smartphone","chips","Devices","new york","Samsung Electronics Co"],"secinfo":{"seolocation":"telecomnews\/lam-research-unveils-improved-tool-to-make-3-d-chips-for-phones-devices"}}" data-news_link="//www.iser-br.com/news/lam-research-unveils-improved-tool-to-make-3-d-chips-for-phones-devices/74472679">