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<\/span><\/figcaption><\/figure>Micron Technology Inc<\/a> on Tuesday said it started shipping its most advanced NAND flash chip<\/a> made up of 232 layers of memory cells that can support intense data use from consumer gadgets, cars and data centers.

A NAND flash chip is a storage chip<\/a> that retains data even when a device is turned off, unlike a DRAM chip<\/a> which loses data when the power is off.

The latest chip transfers data 50% faster than Micron<\/a>'s previous generation NAND chips<\/a>, said Alvaro Toledo, general manager of the data center storage division.

While logic chips<\/a> have become faster with smaller transistor sizes, in the past decade storage chips have been increasing the number of layers after hitting challenges getting the improvements and cost savings needed just from shrinking the transistor size.

Toledo said 16 of these 232-layer NAND chips can be packaged together in a casing about a third of the size of a stamp and can hold 2 TeraBytes of data.

Mass production of the 232-layer NAND is expected to start in late 2022, he said.
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美光科技开始航运最先进的存储芯片

最新的芯片传输数据的速度要比传统的方法快50%微米的上一代NAND芯片,阿尔瓦罗·托莱多说,总经理数据中心存储部门。

  • 更新于2022年7月26日下午07:04坚持
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美光科技有限公司周二表示,它开始航运其最先进的NAND闪存芯片由232层的记忆细胞能够支持强烈的数据从消费者使用产品,汽车和数据中心。

NAND闪存芯片存储芯片保留数据即使设备是关闭的,不像一个DRAM芯片权力时丢失数据。

最新的芯片传输数据的速度要比传统的方法快50%微米的上一代NAND闪存芯片总经理说,阿尔瓦罗·托莱多数据中心存储部门。

而逻辑芯片已经变得更快和更小的晶体管尺寸,在过去的十年中存储芯片已增加层数达到挑战得到改进和成本节约需要从缩小晶体管的大小。

广告
托莱多说这些232 - 16层NAND芯片可以打包在一起,套管的三分之一大小的邮票,可以容纳2 tb的数据。

大规模生产的232 -层与非预计在2022年晚些时候开始,他说。
  • 发布于2022年7月26日下午06:52坚持
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<\/span><\/figcaption><\/figure>Micron Technology Inc<\/a> on Tuesday said it started shipping its most advanced NAND flash chip<\/a> made up of 232 layers of memory cells that can support intense data use from consumer gadgets, cars and data centers.

A NAND flash chip is a storage chip<\/a> that retains data even when a device is turned off, unlike a DRAM chip<\/a> which loses data when the power is off.

The latest chip transfers data 50% faster than Micron<\/a>'s previous generation NAND chips<\/a>, said Alvaro Toledo, general manager of the data center storage division.

While logic chips<\/a> have become faster with smaller transistor sizes, in the past decade storage chips have been increasing the number of layers after hitting challenges getting the improvements and cost savings needed just from shrinking the transistor size.

Toledo said 16 of these 232-layer NAND chips can be packaged together in a casing about a third of the size of a stamp and can hold 2 TeraBytes of data.

Mass production of the 232-layer NAND is expected to start in late 2022, he said.
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