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Under the DLI Scheme, which was announced by MeitY in December, financial incentives and design infrastructure support will be extended to domestic companies, startups and MSMEs across various stages of development and deployment of semiconductor design for Integrated Circuits<\/a> (ICs), Chipsets, System on Chips (SoCs), Systems and IP Cores and semiconductor linked design for over a period of five years.
According to MeitY, the scheme, which was a part of Rs 76,000 crore (USD 10 billion) package that the government announced in December, aims to nurture at least 20 domestic companies involved in semiconductor design and facilitate them to achieve turnover of more than Rs 1500 crore in the next five years.
\"Centre for Development of Advanced Computing (C-DAC), a scientific society operating under MeitY, will serve as the nodal agency for implementation of the DLI scheme,\" the statement reads.
The scheme has three components - Chip<\/a> Design infrastructure support, Product Design Linked Incentive and Deployment Linked Incentive.
Under the Chip Design infrastructure support, C-DAC will set up the India Chip Centre<\/a> to host the state-of-the-art design infrastructure (viz. EDA Tools, IP Cores and support for MPW (Multi Project Wafer fabrication) and post-silicon validation) and facilitate its access to supported companies.
Under the Product Design Linked Incentive component, reimbursement of up to 50 per cent of the eligible expenditure subject to a ceiling of Rs 15 crore per application will be provided as fiscal support to the approved applicants who are engaged in semiconductor design.
Under the Deployment Linked Incentive component, an incentive of 6 per cent to 4 per cent of net sales turnover over five years subject to a ceiling of Rs 30 Crore per application will be provided to approved applicants whose semiconductor design for Integrated Circuits (ICs), Chipsets, System on Chips (SoCs), Systems and IP Cores and semiconductor linked design are deployed in electronic products.
The approved applicants that claim incentives under the scheme will be encouraged to retain their domestic status (i.e., more than 50 per cent of the capital in it is beneficially owned by resident Indian citizens and\/ or Indian companies, which are ultimately owned and controlled by resident Indian citizens) for a period of three years after claiming incentives under the scheme.
An applicant must meet the Threshold and Ceiling Limits to be eligible for disbursement of incentives under the Scheme.
A dedicated portal has been made available for inviting Online applications from January 1, 2022, to December 31, 2024. The applicants can find the guidelines of the DLI Scheme on the portal and register themselves for availing of support under the scheme.
The DLI Scheme will also take a graded and pre-emptive approach to Identify the Products of national priorities and implement strategies for their complete or near-complete indigenisation and deployment thereby taking steps towards the import substitution and value addition in strategic and societal sectors.
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电子产品,它邀请应用程序从国内半导体芯片设计公司
根据MeitY,方案,76000卢比的一部分(100亿美元)计划在12月,政府宣布,旨在培养至少20国内企业参与半导体设计和帮助他们实现营业额超过1500卢比在接下来的五年。
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DLI方案下,由MeitY宣布12月,财务激励和设计基础设施支持将扩展到国内企业,初创公司和男男同性恋者在不同的半导体设计开发和部署阶段集成电路(ICs)、芯片、系统芯片(soc),系统和IP核和半导体设计的五年。
根据MeitY,方案,76000卢比的一部分(100亿美元)计划在12月,政府宣布,旨在培养至少20国内企业参与半导体设计和帮助他们实现营业额超过1500卢比在接下来的五年。
“中心发展先进的计算(C-DAC),一个科学的社会MeitY下操作,将作为DLI节点机构实施的计划,”声明中写道。
该计划有三个组件芯片设计基础设施支持,产品设计与激励和部署相关的激励。
在芯片设计基础设施支持下,C-DAC将设置印度芯片中心举办的最先进的设计基础设施(即EDA工具,IP核和支持”(多项目晶圆),和post-silicon验证)和促进其访问支持公司。
下产品设计与动力组件,高达50%的合格的报销支出受到上限15卢比/应用程序将提供财政支持批准申请人从事半导体设计。
部署相关激励下组件,一个激励的净营业额的6%到4%在五年内受到天花板30卢比/应用程序将提供批准申请人的半导体集成电路(ic)设计、芯片、系统芯片(soc),系统和IP核和半导体设计部署在电子产品有关。
批准申请人声称激励计划将鼓励下(即保留国内地位。,超过50%的资金由居民实益拥有印度公民和/或印度公司,最终由居民拥有和控制的印度公民)一段三年之后声称激励方案。
申请人必须满足阈值和天花板限制有资格获得支付的激励方案。
已经提供一个专门的门户邀请在线应用程序从1月1日2022年,2024年12月31日。申请人可以找到DLI方案的指导方针在门户和注册自己主张的支持下计划。
DLI方案还将分级和先发制人的方法来识别产品的国家重点和实施完全或几乎完全本土化策略和部署从而采取措施对进口替代在战略和社会领域和价值增加。
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