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<\/span><\/figcaption><\/figure>San Francisco: The US-based chipmaker Qualcomm<\/a> has announced two new feature-packed, ultra-low-power wireless audio platforms<\/a> -- S5 Sound Platform and S3 Sound Platform -- with support for Snapdragon Sound technology<\/a>.

These optimised platforms are dual-mode, combining traditional Bluetooth wireless audio and the latest LE Audio technology standard.

\"In these tiny platforms, we integrated our Adaptive Active Noise Cancellation in a dedicated hardware block, and as a result are bringing substantial noise cancellation improvements, to whatever is in a listener's earbud,\" James Chapman, vice president and general manager, Voice, Music and Wearables, Qualcomm Technologies<\/a>, said in a statement.

The new platforms offer audio OEMs broad flexibility for device customisation at a range of tiers, unlocking new design opportunities.

The wide range of user experiences are underpinned by an enhanced platform architecture that achieves double the compute capability compared to our previous generation wireless audio platforms, with no compromise to ultra-low-power performance.

The Qualcomm S5<\/a> and S3 Sound Platforms are sampling to customers with commercial products expected in the second half of 2022.<\/body>","next_sibling":[{"msid":89912744,"title":"Sterlite Technologies collaborates Analog Devices to develop 5G Open RAN radios","entity_type":"ARTICLE","link":"\/news\/sterlite-technologies-collaborates-analog-devices-to-develop-5g-open-ran-radios\/89912744","category_name":null,"category_name_seo":"telecomnews"}],"related_content":[],"msid":89916357,"entity_type":"ARTICLE","title":"Qualcomm unveils two new audio platforms","synopsis":"The new platforms offer audio OEMs broad flexibility for device customisation at a range of tiers, unlocking new design opportunities.","titleseo":"telecomnews\/qualcomm-unveils-two-new-audio-platforms","status":"ACTIVE","authors":[],"Alttitle":{"minfo":""},"artag":"IANS","artdate":"2022-03-01 11:36:19","lastupd":"2022-03-01 11:40:31","breadcrumbTags":["qualcomm","snapdragon sound","qualcomm technologies","devices","audio platforms","ultra low poer wireless audio platforms","Snapdragon Sound technology","atest LE Audio technology standard","Qualcomm S5","Qualcomm S3"],"secinfo":{"seolocation":"telecomnews\/qualcomm-unveils-two-new-audio-platforms"}}" data-authors="[" "]" data-category-name="" data-category_id="" data-date="2022-03-01" data-index="article_1">

高通公司推出两个新音频平台

新平台提供音频oem厂商广泛的灵活性在一系列层设备定制,解锁新的设计机会。

  • 更新2022年3月1日上午11点坚持
旧金山:美国芯片制造商高通宣布了两个新功能强大,超低功耗无线音频平台——S5声音平台和S3声音平台支持金鱼草的声音技术。

这些优化平台双模式,结合传统的蓝牙无线音频和最新的音频技术标准。

“在这些小平台,我们综合自适应有源噪声取消在一块专用硬件,因此带来实质性的降噪改进,无论在一个侦听器的耳塞,”詹姆斯·查普曼,副总裁和总经理,声音,音乐和衣物,高通技术在一份声明中说。

广告
新平台提供音频oem厂商广泛的灵活性在一系列层设备定制,解锁新的设计机会。

广泛的用户体验是支撑一个增强的平台架构,达到两倍计算能力与我们的上一代无线音频平台相比,没有妥协的超低功耗性能。

的高通S5和S3声音平台与商业产品抽样客户预计在2022年下半年。
  • 发布于2022年3月1日凌晨36是
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\"\"
<\/span><\/figcaption><\/figure>San Francisco: The US-based chipmaker Qualcomm<\/a> has announced two new feature-packed, ultra-low-power wireless audio platforms<\/a> -- S5 Sound Platform and S3 Sound Platform -- with support for Snapdragon Sound technology<\/a>.

These optimised platforms are dual-mode, combining traditional Bluetooth wireless audio and the latest LE Audio technology standard.

\"In these tiny platforms, we integrated our Adaptive Active Noise Cancellation in a dedicated hardware block, and as a result are bringing substantial noise cancellation improvements, to whatever is in a listener's earbud,\" James Chapman, vice president and general manager, Voice, Music and Wearables, Qualcomm Technologies<\/a>, said in a statement.

The new platforms offer audio OEMs broad flexibility for device customisation at a range of tiers, unlocking new design opportunities.

The wide range of user experiences are underpinned by an enhanced platform architecture that achieves double the compute capability compared to our previous generation wireless audio platforms, with no compromise to ultra-low-power performance.

The Qualcomm S5<\/a> and S3 Sound Platforms are sampling to customers with commercial products expected in the second half of 2022.<\/body>","next_sibling":[{"msid":89912744,"title":"Sterlite Technologies collaborates Analog Devices to develop 5G Open RAN radios","entity_type":"ARTICLE","link":"\/news\/sterlite-technologies-collaborates-analog-devices-to-develop-5g-open-ran-radios\/89912744","category_name":null,"category_name_seo":"telecomnews"}],"related_content":[],"msid":89916357,"entity_type":"ARTICLE","title":"Qualcomm unveils two new audio platforms","synopsis":"The new platforms offer audio OEMs broad flexibility for device customisation at a range of tiers, unlocking new design opportunities.","titleseo":"telecomnews\/qualcomm-unveils-two-new-audio-platforms","status":"ACTIVE","authors":[],"Alttitle":{"minfo":""},"artag":"IANS","artdate":"2022-03-01 11:36:19","lastupd":"2022-03-01 11:40:31","breadcrumbTags":["qualcomm","snapdragon sound","qualcomm technologies","devices","audio platforms","ultra low poer wireless audio platforms","Snapdragon Sound technology","atest LE Audio technology standard","Qualcomm S5","Qualcomm S3"],"secinfo":{"seolocation":"telecomnews\/qualcomm-unveils-two-new-audio-platforms"}}" data-news_link="//www.iser-br.com/news/qualcomm-unveils-two-new-audio-platforms/89916357">