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Samsung Electronics<\/a>' chip contract manufacturing business said on Tuesday it plans to more than triple its advanced chips production capacity by 2027 to meet strong demand despite current global economic headwinds.
The world's second-largest foundry after Taiwan Semiconductor Manufacturing Co<\/a> (TSMC<\/a>) is targeting mass production of advanced 2-nanometre technology chips by 2025 and 1.4-nanometre chips by 2027, set for use in applications such as high-performance computing and artificial intelligence.
\"There has been some progress (in raising prices) this year, and costs are being reflected... New orders won currently will be made after 2-3 years, so the direct impact of the current atmosphere will be minimal,\" said Moonsoo Kang, executive vice president of Samsung<\/a> Electronics' foundry business.
Samsung began mass producing chips with 3-nanometre technology in June. The company was in talks with potential customers for 3-nanometre collaboration, including Qualcomm, Tesla and Advanced Micro Devices<\/a>, Samsung said.
Samsung, the world's largest memory chip maker, has had difficulties in meeting clients' expectations for foundry yields in recent years. Analysts said the company had pushed advanced technology too quickly to compete with TSMC, but had suffered from having less experience with the long-term client cooperation needed in contract manufacturing.
Samsung co-CEO Kyung Kye-hyun told reporters its foundry business had lagged TSMC's development schedule and performance in 5- and 4-nanometre chips, but customers were interested in the second version of 3-nanometre chips to be made from 2024.
\"We have been keeping in line with customers' expectations since the start of 3-nanometre mass production this year,\" Kang said.
He noted that demand for advanced 5-nanometre and finer chips is rapidly increasing despite current inflationary pressures due to long-term expansion of high-performance computing, artificial intelligence, 5G and 6G connectivity and automotive applications.
The industry may find it difficult to meet demand even if all planned investments are executed, he said.
The limited number of advanced chipmaking machines that can be produced by Dutch company ASML limits how much advanced chip capacity can be added, Kang added.
\"U.S. customers are especially interested in production in the United States, for supply chain stability,\" Kang said. \"Our Taylor site is very large... It's a good site for expansion,\" he added.
Samsung is currently building chip production in Taylor, Texas for operations starting in 2024.
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三星加热器三先进的芯片生产,到2027年,看到了强劲的需求
世界第二大铸造后台湾半导体制造公司(台积电)是针对大规模生产的先进2-nanometre技术芯片2025和1.4纳米芯片,到2027年,将用于高性能计算和人工智能等应用程序。
三星电子芯片代工业务周二表示,该公司计划将超过其先进的芯片生产能力由2027增至3倍,以应对需求强劲,尽管目前全球经济逆风。
世界第二大铸造台湾半导体制造公司(台积电)是针对大规模生产的先进2-nanometre技术芯片2025和1.4纳米芯片,到2027年,将用于高性能计算和人工智能等应用程序。
“一些进展(提高价格),今年和成本反映了…新订单就目前将2 - 3年后,所以直接影响当前的气氛会非常少,“Moonsoo Kang说,执行副总裁三星电子产品的铸造业务。
三星在6月开始批量制作芯片3-nanometre技术。公司正在与潜在客户进行谈判3-nanometre协作,包括高通,特斯拉和高级微设备、三星说。
三星是世界上最大的存储芯片制造商,有困难会议客户近年来对铸造的预期收益率。分析师表示,该公司把先进技术过快与台积电竞争,但患有少经验与所需的长期客户合作合同制造。
三星联合ceo Kyung Kye-hyun告诉记者,其铸造业务已经落后于台积电的发展进度和性能在5 -和4-nanometre芯片,但顾客感兴趣的第二个版本3-nanometre芯片从2024年。
“我们一直保持符合客户预期今年3-nanometre以来的大规模生产,”康说。
他指出,先进5-nanometre和更好的芯片的需求迅速增加,尽管当前通胀压力由于长期扩张的高性能计算、人工智能、5 g和6 g连接和汽车应用。
这个行业可能难以满足需求即使所有执行投资计划,他说。
先进的芯片制造机器的数量有限,可以由荷兰ASML公司限制多少先进的芯片容量可以添加,康补充道。
“美国客户生产在美国特别感兴趣,对于供应链的稳定性,”康说。“我们的泰勒网站是非常大的…这是一个很好的网站扩张,”他补充道。
在德州泰勒,三星正在建造芯片生产业务从2024年开始。
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