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智能手机由联发科Dimensity 1200、1100 5 g芯片推出2温度系数

Dimensity 1200和1100包一个集成5 g调制解调器与联发科的5 g UltraSave技术,同时也支持5 g SA和国家安全局架构,5 g载波聚合(2 cc)在FDD和TDD、动态频谱共享,真正的双卡5克,新的语音广播(VoNR)。

1200年Dimensity octa-core CPU,包括手臂Cortex-A78达到3 ghz,三臂Cortex-A78超级核心和四臂Cortex-A55效率的核心。它还有一个九个核心GPU和六核联发科APU 3.0。
1200年Dimensity octa-core CPU,包括手臂Cortex-A78达到3 ghz,三臂Cortex-A78超级核心和四臂Cortex-A55效率的核心。它还有一个九个核心GPU和六核联发科APU 3.0。
新德里:台湾制程芯片制造商周三推出了两个新联发科5克芯片组,联发科Dimensity 1200和联发科Dimensity 1100与人工智能相机,amd多媒体的改进。

第一个智能手机由新的Dimensity 1200和1100芯片组预计年底上市Q1和Q2今年年初,它说。

1200年Dimensity octa-core CPU,包括手臂Cortex-A78达到3 ghz,三臂Cortex-A78超级核心和四臂Cortex-A55效率的核心。它还有一个九个核心GPU和六核联发科APU 3.0。

Dimensity 1100是一种包括四个胳膊Cortex-A78 octa-core CPU核心操作高达2.6 ghz和四臂Cortex-A55效率核心,以及九个核心手臂Mali-G77 GPU。

芯片组是台积电的生产6 nm制程技术。

Dimensity 1200和1100包一个集成5 g调制解调器与联发科的5 g UltraSave技术,同时也支持5 g SA和国家安全局架构,5 g载波聚合(2 cc)在FDD和TDD、动态频谱共享,真正的双卡5克,新的语音广播(VoNR)。

芯片还集成5 g高铁模式和5克电梯模式确保无缝连接,根据芯片制造商。

Dimensity 1200支持200像素的照片由五芯HDR-ISP,交错4 k HDR视频和联发科APU 3.0。虽然Dimensity 1100包108像素的摄像头支持,联发科集成现有的APU 3.0。

芯片组支持人工智能相机功能包括AI-Panorama夜晚拍摄,AI多人散景,人工智能降噪(AINR)和HDR功能。芯片还支持新的增高视频回放功能。

Dimensity 1200支持168 hz刷新率和Dimensity 1100与144 hz刷新率也支持显示。联发科芯片支持的HyperEngine 3.0游戏技术。

Dimensity 1200年和1100年都支持蓝牙5.2和超低延迟真正无线立体声音频和LC3编码。

“我们新的Dimensity 1200令人印象深刻的200像素的摄像头支持和高级人工智能功能,除了创新连接,显示、音频和游戏增强,“JC Hsu说,公司副总裁和总经理联发科的无线通信业务单元。


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The government in 2017 had set up a high-level forum to evaluate and approve roadmaps and action plans to bring 5G in the country by 2020. The panel comprised of members from academia, industry stakeholders and secretaries of ministries of telecom, IT, and science and technology and set aside a corpus of Rs 500 crore for R&D activities.<\/p>","title":"Government panel set up in 2017","titleseo":"government-panel-set-up-in-2017","slideseolocationalt":"slide-shows\/indias-5g-journey-where-does-the-telecom-industry-stand\/government-panel-set-up-in-2017","prominentcolor":"","imgtype":"1"},"slideshows":[{"msid":"72370179","mstype":0,"denmarkslideshow":1,"strimg":"","thumbid":"72370313","secname":"India's 5G journey: Where does the telecom industry stand?","secnameseo":"india-s-5g-journey-where-does-the-telecom-industry-stand","msname":"Government panel set up in 2017","artdate":1575467694,"caption":"","msnameseo":"government-panel-set-up-in-2017","secmsname":"India's 5G journey: Where does the telecom industry stand?","secmsnameseo":"india-s-5g-journey-where-does-the-telecom-industry-stand","seolocationalt":"indias-5g-journey-where-does-the-telecom-industry-stand\/government-panel-set-up-in-2017"}],"filters":[],"url":"\/\/www.iser-br.com\/news\/smartphones-powered-by-mediatek-dimensity-1200-1100-5g-chipsets-to-launch-in-2q21\/80363723","content":"
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The Dimensity 1200 has an octa-core CPU, comprising Arm Cortex-A78 clocked up to 3GHz, three Arm Cortex-A78 super cores and four Arm Cortex-A55 efficiency cores. It also features a nine-core GPU and hexa-core MediaTek APU 3.0.<\/span><\/figcaption><\/figure>NEW DELHI: Taiwanese fabless chipmaker MediaTek on Wednesday launched two new 5G<\/a> chipsets--MediaTek Dimensity 1200 and MediaTek Dimensity 1100<\/a> with AI, camera, amd multimedia improvements.

The first smartphones powered by the new Dimensity 1200 and 1100 chipsets are expected to hit the market at the end of Q1 and beginning of Q2 this year, it said.

The Dimensity 1200 has an octa-core CPU, comprising Arm Cortex-A78 clocked up to 3GHz, three Arm Cortex-A78 super cores and four Arm Cortex-A55 efficiency cores. It also features a nine-core GPU and hexa-core MediaTek APU 3.0.