![\"\"](\"\/\/www.iser-br.com\/Themes\/Release\/images\/responsive\/ettelecom-default.jpg\")
As demand soars for chips<\/a> used in everything from smartphones<\/a> to cars, supply chain bottlenecks going on for almost two years have created havoc in several global industries, including automotive, healthcare and telecoms.
Franco-Italian ST said the new integrated silicon carbide (SiC<\/a>) substrate manufacturing facility would meet increasing demand from automotive and industrial customers amid a transition to electrification.
The five-year investment, due to be completed in 2026, will be supported with 292.5 million euros of public funds from Italy, as part of the country's National Recovery and Resilience Plan, with the grant approved by the European Commission.
\"The Italian measure approved today will strengthen Europe's semiconductors supply chain, helping us deliver our green and digital transition,\" European Commission Executive Vice-President Margrethe Vestager said in a separate statement.
\"The measure will ensure that our industry has a reliable source of innovative substrates for power efficient chips,\" she added.
To boost production capacity in Europe, Brussels earlier this year launched the so-called Chips Act<\/a>, enabling 15 billion euros in additional public and private investment in the industry by 2030, on top of 30 billion euros of public investments already planned from NextGenerationEU<\/a>, Horizon Europe and national budgets.
ST will build the new plant at its Catania site in Sicily, alongside an existing SiC device manufacturing facility. It will create around 700 additional jobs, the group said.
\"This new facility will be key to our vertical integration in SiC ... as we further ramp up volumes to support our automotive and industrial customers in their shift to electrification and higher efficiency,\" ST CEO Jean-Marc Chery said.
Production is expected to start in 2023, with a balanced supply of SiC substrate between internal and merchant supply, ST said.
Rival chipmaker Intel<\/a> has also announced it will build a multibillion-euro chip factory in Italy and is in talks with Rome to strike a final deal and identify a suitable area for the investment.
<\/body>","next_sibling":[{"msid":94656540,"title":"Cisco to start hardware products manufacturing in India: Sanjay Kaul","entity_type":"ARTICLE","link":"\/news\/cisco-to-set-up-hardware-manufacturing-unit-in-india\/94656540","category_name":null,"category_name_seo":"telecomnews"}],"related_content":[],"msid":94660430,"entity_type":"ARTICLE","title":"STMicroelectronics to build $728 million chip plant in Italy","synopsis":"As demand soars for chips used in everything from smartphones to cars, supply chain bottlenecks going on for almost two years have created havoc in several global industries, including automotive, healthcare and telecoms.","titleseo":"telecomnews\/stmicroelectronics-to-build-728-million-chip-plant-in-italy","status":"ACTIVE","authors":[],"analytics":{"comments":0,"views":236,"shares":0,"engagementtimems":1050000},"Alttitle":{"minfo":""},"artag":"Reuters","artdate":"2022-10-05 14:53:39","lastupd":"2022-10-05 14:59:33","breadcrumbTags":["STMicroelectronics","SiC","chips","italy","smartphones","chips act","intel","devices","NextGenerationEU"],"secinfo":{"seolocation":"telecomnews\/stmicroelectronics-to-build-728-million-chip-plant-in-italy"}}" data-authors="[" "]" data-category-name="" data-category_id="" data-date="2022-10-05" data-index="article_1">
- Telecom乐动扑克News
- 2分钟阅读
意法半导体在意大利建立7.28亿美元的芯片工厂
随着需求上升为芯片用于从智能手机到汽车供应链瓶颈进行了几乎两年在几个全球产业造成严重破坏,包括汽车、医疗和电信。
读到
随着需求上升为芯片用于从智能手机汽车供应链瓶颈进行了几乎两年创造了破坏在几个全球行业,包括汽车、医疗和电信。
意法圣说,新的集成碳化硅(原文如此)衬底制造工厂将满足汽车和工业客户日益增长的需求而在过渡到电气化。
五年投资,由于在2026年完工,将从意大利2.925亿欧元的公共资金支持,作为国家经济复苏和弹性的一部分计划,授予欧盟委员会(European Commission)批准。
“今天意大利测量批准将加强欧洲的半导体供应链,帮助我们提供绿色和数字转换,”欧洲委员会执行副总裁Margrethe Vestager在另一项声明中说。
”措施将确保我们的产业创新的可靠来源基质对权力高效芯片,”她补充道。
提高生产能力在欧洲,欧盟今年早些时候推出了所谓的芯片的行为,使150亿欧元的额外的公共和私人投资的产业,到2030年的300亿欧元的公共投资已经计划NextGenerationEU欧洲和国家预算,地平线。
圣将建立新工厂的卡塔尼亚网站在西西里,与现有的碳化硅设备制造厂。它将创造约700额外的工作,该组织说。
“这新设施将在SiC我们垂直整合的关键…随着我们进一步加大量来支持我们的汽车和工业客户转向电气化和更高的效率,”圣首席执行官jean - marc奇瑞说。
预计在2023年开始生产,供给平衡内部和商人之间的碳化硅衬底供应,圣说。
竞争对手的芯片制造商英特尔还宣布,它将建立一个发行数十亿欧元芯片工厂在意大利和正与罗马达成最终协议,确定一个适合投资的领域。
评论
现在评论 阅读评论(1)所有评论
找到这个评论进攻?
下面选择你的理由并单击submit按钮。这将提醒我们的版主采取行动