Some feature more than 50 billion tiny transistors that are 10,000 times smaller than the width of a human hair. They are made on gigantic, ultraclean factory room floors that can be seven stories tall and run the length of four football fields.

Microchips are in many ways the lifeblood of the modern economy. They power computers, smartphones, cars, appliances and scores of other electronics. But the world’s demand for them has surged since the pandemic, which also caused supply-chain disruptions, resulting in a global shortage.

That, in turn, is fueling inflation and raising alarms that the United States is becoming too dependent on chips made abroad. The United States accounts for only about 12% of global semiconductor manufacturing<\/a> capacity; more than 90% of the most advanced chips come from Taiwan.

Intel<\/a>, a Silicon Valley titan that is seeking to restore its longtime lead in chip manufacturing technology, is making a $20 billion bet that it can help ease the chip shortfall. It is building two factories at its chip-making complex in Chandler, Arizona, that will take three years to complete, and recently announced plans for a potentially bigger expansion, with new sites in New Albany, Ohio, and Magdeburg, Germany.

Why does making millions of these tiny components mean building — and spending — so big? A look inside Intel production plants in Chandler and Hillsboro, Oregon, provides some answers.

What Chips Do<\/strong>
Chips, or integrated circuits, began to replace bulky individual transistors in the late 1950s. Many of those tiny components are produced on a piece of silicon and connected to work together. The resulting chips store data, amplify radio signals and perform other operations; Intel is famous for a variety called microprocessors, which perform most of the calculating functions of a computer.

\"&lt;p&gt;One
One of the machines used to etch materials from silicon wafers as microchips are fabricated at Intel's complex<\/span><\/figcaption><\/figure>Intel has managed to shrink transistors on its microprocessors to mind-bending sizes. But the rival Taiwan Semiconductor Manufacturing Co. can make even tinier components, a key reason Apple<\/a> chose it to make the chips for its latest iPhones<\/a>.

Such wins by a company based in Taiwan, an island that China claims as its own, add to signs of a growing technology gap that could put advances in computing, consumer
devices<\/a> and military hardware at risk from both China’s ambitions and natural threats in Taiwan such as earthquakes and drought. And it has put a spotlight on Intel’s efforts to recapture the technology lead.

How Chips Are Made<\/strong>
Chipmakers are packing more and more transistors onto each piece of silicon, which is why technology does more each year. It’s also the reason that new chip factories cost billions and fewer companies can afford to build them.

In addition to paying for buildings and machinery, companies must spend heavily to develop the complex processing steps used to fabricate chips from plate-size silicon wafers — which is why the factories are called “fabs.”

Enormous machines project designs for chips across each wafer, and then deposit and etch away layers of materials to create their transistors and connect them. Up to 25 wafers at a time move among those systems in special pods on automated overhead tracks.

Processing a wafer takes thousands of steps and up to two months.
TSMC<\/a> has set the pace for output in recent years, operating “gigafabs,” sites with four or more production lines. Dan Hutcheson, vice chair of market-research firm TechInsights, estimated that each site can process more than 100,000 wafers a month. He estimated the capacity of Intel’s two planned $10 billion facilities in Arizona at roughly 40,000 wafers a month each.

How Chips Are Packaged<\/strong>
After processing, the wafer is sliced into individual chips. These are tested and wrapped in plastic packages to connect them to circuit boards or parts of a system.

That step has become a new battleground, because it is more difficult to make transistors even smaller. Companies are now stacking multiple chips or laying them side by side in a package, connecting them to act as a single piece of silicon.

Where packaging a handful of chips together is now routine, Intel has developed one advanced product that uses new technology to bundle a remarkable 47 individual chips, including some made by TSMC and other companies as well those produced in Intel fabs.

What Makes Chip Factories Different<\/strong>
Intel chips typically sell for hundreds to thousands of dollars each. Intel in March released its fastest microprocessor for desktop computers, for example, at a starting price of $739. A piece of dust invisible to the human eye can ruin one. So fabs have to be cleaner than a hospital operating room and need complex systems to filter air and regulate temperature and humidity.
\"&lt;p&gt;The
The specialized machines that receive pods full of silicon wafers in the making of microchips.<\/span><\/figcaption><\/figure>Fabs must also be impervious to just about any vibration, which can cause costly equipment to malfunction. So fab clean rooms are built on enormous concrete slabs on special shock absorbers.

Also critical is the ability to move vast amounts of liquids and gases. The top level of Intel’s factories, which are about 70 feet tall, have giant fans to help circulate air to the clean room directly below. Below the clean room are thousands of pumps, transformers, power cabinets, utility pipes and chillers that connect to production machines.

The Need for Water<\/strong>
Fabs are water-intensive operations. That’s because water is needed to clean wafers at many stages of the production process.

Intel’s two sites in Chandler collectively draw about 11 million gallons of water a day from the local utility. Intel’s future expansion will require considerably more, a seeming challenge for a drought-plagued state like Arizona, which has cut water allocations to farmers. But farming actually consumes much more water than a chip plant.

Intel says its Chandler sites, which rely on supplies from three rivers and a system of wells, reclaim about 82% of the freshwater they use through filtration systems, settling ponds and other equipment. That water is sent back to the city, which operates treatment facilities that Intel funded, and which redistributes it for irrigation and other nonpotable uses.

Intel hopes to help boost the water supply in Arizona and other states by 2030, by working with environmental groups and others on projects that save and restore water for local communities.
\"&lt;p&gt;Pods
Pods holding up to 25 of the silicon wafers used to make microchips move on automated overhead tracks.<\/span><\/figcaption><\/figure>How Fabs Are Built<\/strong>
To build its future factories, Intel will need roughly 5,000 skilled construction workers for three years.

They have a lot to do. Excavating the foundations is expected to remove 890,000 cubic yards of dirt, carted away at a rate of one dump truck per minute, said Dan Doron, Intel’s construction chief.

The company expects to pour more than 445,000 cubic yards of concrete and use 100,000 tons of reinforcement steel for the foundations — more than in constructing the world’s tallest building, the Burj Khalifa in Dubai, United Arab Emirates.

Some cranes for the construction are so large that more than 100 trucks are needed to bring the pieces to assemble them, Doron said. The cranes will lift, among other things, 55-ton chillers for the new fabs.

Patrick Gelsinger<\/a>, who became Intel’s CEO a year ago, is lobbying Congress to provide grants for fab construction and tax credits for equipment investment. To manage Intel’s spending risk, he plans to emphasize construction of fab “shells” that can be outfitted with equipment to respond to market changes.

To address the chip shortage, Gelsinger will have to make good on his plan to produce chips designed by other companies. But a single company can do only so much; products like phones and cars require components from many suppliers, as well as older chips. And no country can stand alone in semiconductors, either. Though boosting domestic manufacturing can reduce supply risks somewhat, the chip industry will continue to rely on a complex global web of companies for raw materials, production equipment, design software, talent and specialized manufacturing.
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巨大的努力产生一个微小的芯片

芯片制造商包装越来越多的晶体管到每一块硅,这就是为什么每年技术做更多。也是新芯片工厂花费数十亿的原因和更少的公司可以建立它们。

  • 更新于2022年4月9日上午11:37坚持
阅读: 100年行业专业人士
读者的形象读到100年行业专业人士

一些功能500亿多微小的晶体管10000倍小于人类头发的宽度。他们是巨大的,超净厂房房间地板可以七层楼高和运行四个足球场的长度。

微芯片在许多方面是现代经济的命脉。他们的权力电脑、智能手机、汽车、家用电器和许多其他电子产品。但世界对他们的需求猛增大流行以来,也导致供应链中断,导致全球短缺。

反过来,助长了通胀和提高警报,美国过于依赖国外芯片了。美国只占全球的12%左右半导体制造能力;超过90%的最先进的芯片来自台湾。

广告
英特尔硅谷巨头正试图恢复其长期在芯片制造技术,使200亿美元打赌,它可以帮助缓解芯片短缺。它正在建造两个工厂在钱德勒的芯片制造复杂,亚利桑那州,这将需要三年才能完成,和最近宣布计划为一个潜在的大扩张,新网站在新奥尔巴尼,俄亥俄州和马格德堡,德国。

为什么让数以百万计的这些微小组件意味着建筑——和支出——如此之大?一看里面英特尔生产工厂在钱德勒和晚宴过后,俄勒冈州,提供了一些答案。

什么芯片
芯片、集成电路开始取代笨重的单个晶体管在1950年代末。产生许多微小组件在一块硅和连接到一起工作。结果芯片存储数据,无线电信号的放大和执行其他操作;英特尔以各种称为微处理器,电脑执行大部分的计算功能。
< p >的一个机器用来从硅片腐蚀材料在英特尔的芯片制造复杂的< / p >
的机器用来从硅片腐蚀材料在英特尔的芯片是捏造出来的复杂
英特尔已设法缩小晶体管在其微处理器最离奇古怪的大小。但竞争对手台湾半导体制造公司可以更小的组件,一个重要原因苹果选择使其最新的芯片iphone

广告
这样赢公司,总部在台湾,一个岛,中国宣称自己的,增加的迹象越来越技术差距,可以把计算机的进步,消费者设备和军事硬件风险来自中国的雄心壮志和自然等台湾地震和干旱的威胁。它把焦点集中在英特尔的努力夺回领先的技术。

芯片是如何制造的
芯片制造商包装越来越多的晶体管到每一块硅,这就是为什么每年技术做更多。也是新芯片工厂花费数十亿的原因和更少的公司可以建立它们。

除了支付建筑和机械,公司必须花费巨资开发复杂的处理步骤用于从餐盘尺寸硅晶圆制造芯片工厂——这就是为什么被称为“晶圆厂”。

巨大的机器项目在每个晶片设计的芯片,然后沉积和蚀刻层的材料来创建他们的晶体管,连接他们。多达25晶圆一次移动这些系统中特别吊舱自动跟踪开销。

处理晶片需要成千上万的步骤和两个月。台积电近年来设置速度为输出,操作“十亿级晶圆厂”,网站有四个或更多的生产线。市场调研公司的副主席Dan Hutcheson TechInsights,估计每个站点可以处理超过100000片晶圆。他估计的能力,英特尔的两个计划100亿美元的设施在亚利桑那州每人大约40000片晶圆。

芯片是如何包装的
处理后,晶片切成单个芯片。这些测试和塑料包装的包将它们连接到电路板或部分系统。

这一步已经成为一个新的战场,因为它是更难使晶体管更小。公司现在叠加多个芯片或铺设他们并排在一个包中,把他们作为一块硅。

包装少数的芯片在一起现在,英特尔已经开发了一个先进的产品,使用新技术来包一个了不起的47个人芯片,包括一些由台积电和其他公司也在英特尔晶圆厂生产。

是什么让芯片工厂不同
英特尔芯片通常卖成百上千美元。最快3月英特尔发布了台式电脑微处理器,例如,起价为739美元。一片灰尘人眼不可见可以毁了一个。所以工厂要比医院手术室清洁,需要复杂的系统来过滤空气和调节温度和湿度。
< p >专业机器接收豆荚完整的硅晶圆制造微芯片。< / p >
专业机器接收豆荚完整的硅晶圆制造微芯片。
晶圆厂也必须不受任何振动,从而导致昂贵的设备故障。所以工厂洁净室是建立在巨大的混凝土板特殊的减震器。

还重要的是能够移动大量的液体和气体。英特尔的工厂的顶层,大约有70英尺高,巨大的球迷帮助在洁净室直接低于空气流通。在洁净室是成千上万的泵,变压器、电力柜、公用管道和冷却器连接生产机器。

对水的需求
晶圆厂是富水操作。这是因为水是需要清洁晶片在生产过程的许多阶段。

英特尔的两个网站在钱德勒集体画每天大约1100万加仑的水从本地实用程序。英特尔的未来发展需要更多,一个看似挑战drought-plagued像亚利桑那州,减少水分配给农民。但实际上农业消耗更多的水比芯片工厂。

英特尔称其钱德勒网站,依靠供应从三个河流和水井,系统回收大约82%的淡水通过过滤系统解决池塘和其他设备。水是发送回城市,英特尔投资运营处理设施,重新分配它用于灌溉和其他nonpotable用途。

英特尔希望帮助提高供水在亚利桑那州和其他州,到2030年,通过与环保团体和其他项目合作保存和恢复水对当地社区。
< p >豆荚持有多达25的硅晶片用于制造微芯片继续跟踪自动化开销。< / p >
豆荚持有多达25的硅晶片用于制造微芯片继续跟踪自动化的开销。
晶圆厂是如何建造的
建立其未来工厂,英特尔将需要大约5000名熟练建筑工人三年了。

他们有很多事情要做。挖掘基础将删除890000立方码的泥土,运走的速度每分钟自动倾卸卡车,Dan Doron说,英特尔的首席。

公司预计将超过445000立方码的钢筋混凝土,使用100000吨钢材的基础——比建造世界上最高的建筑,哈利法塔在迪拜,阿拉伯联合酋长国。

一些起重机建造如此之大,超过100辆卡车需要把部分组装,Doron说。起重机将提升,除此之外,55-ton冷却器为新晶圆厂。

帕特里克·基辛格一年前,成为英特尔的首席执行官,游说国会工厂建设提供资金和设备投资税收抵免。英特尔支出管理风险,他计划强调建设工厂“壳”,可以配备设备来应对市场变化。

解决芯片短缺,基辛格将不得不兑现他的计划由其他公司生产的芯片设计。但一个公司能做的也只有这么多了;手机和汽车等产品需要从许多供应商组件,以及旧的芯片。和没有一个国家能独自站在半导体、。尽管有所提振国内制造业可以降低供应风险,芯片行业将继续依赖于一个复杂的全球网络公司对原材料,生产设备,设计软件、人才和专业制造。

  • 发布于2022年4月9日,36点坚持
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Some feature more than 50 billion tiny transistors that are 10,000 times smaller than the width of a human hair. They are made on gigantic, ultraclean factory room floors that can be seven stories tall and run the length of four football fields.

Microchips are in many ways the lifeblood of the modern economy. They power computers, smartphones, cars, appliances and scores of other electronics. But the world’s demand for them has surged since the pandemic, which also caused supply-chain disruptions, resulting in a global shortage.

That, in turn, is fueling inflation and raising alarms that the United States is becoming too dependent on chips made abroad. The United States accounts for only about 12% of global semiconductor manufacturing<\/a> capacity; more than 90% of the most advanced chips come from Taiwan.

Intel<\/a>, a Silicon Valley titan that is seeking to restore its longtime lead in chip manufacturing technology, is making a $20 billion bet that it can help ease the chip shortfall. It is building two factories at its chip-making complex in Chandler, Arizona, that will take three years to complete, and recently announced plans for a potentially bigger expansion, with new sites in New Albany, Ohio, and Magdeburg, Germany.

Why does making millions of these tiny components mean building — and spending — so big? A look inside Intel production plants in Chandler and Hillsboro, Oregon, provides some answers.

What Chips Do<\/strong>
Chips, or integrated circuits, began to replace bulky individual transistors in the late 1950s. Many of those tiny components are produced on a piece of silicon and connected to work together. The resulting chips store data, amplify radio signals and perform other operations; Intel is famous for a variety called microprocessors, which perform most of the calculating functions of a computer.

\"&lt;p&gt;One
One of the machines used to etch materials from silicon wafers as microchips are fabricated at Intel's complex<\/span><\/figcaption><\/figure>Intel has managed to shrink transistors on its microprocessors to mind-bending sizes. But the rival Taiwan Semiconductor Manufacturing Co. can make even tinier components, a key reason Apple<\/a> chose it to make the chips for its latest iPhones<\/a>.

Such wins by a company based in Taiwan, an island that China claims as its own, add to signs of a growing technology gap that could put advances in computing, consumer
devices<\/a> and military hardware at risk from both China’s ambitions and natural threats in Taiwan such as earthquakes and drought. And it has put a spotlight on Intel’s efforts to recapture the technology lead.

How Chips Are Made<\/strong>
Chipmakers are packing more and more transistors onto each piece of silicon, which is why technology does more each year. It’s also the reason that new chip factories cost billions and fewer companies can afford to build them.

In addition to paying for buildings and machinery, companies must spend heavily to develop the complex processing steps used to fabricate chips from plate-size silicon wafers — which is why the factories are called “fabs.”

Enormous machines project designs for chips across each wafer, and then deposit and etch away layers of materials to create their transistors and connect them. Up to 25 wafers at a time move among those systems in special pods on automated overhead tracks.

Processing a wafer takes thousands of steps and up to two months.
TSMC<\/a> has set the pace for output in recent years, operating “gigafabs,” sites with four or more production lines. Dan Hutcheson, vice chair of market-research firm TechInsights, estimated that each site can process more than 100,000 wafers a month. He estimated the capacity of Intel’s two planned $10 billion facilities in Arizona at roughly 40,000 wafers a month each.

How Chips Are Packaged<\/strong>
After processing, the wafer is sliced into individual chips. These are tested and wrapped in plastic packages to connect them to circuit boards or parts of a system.

That step has become a new battleground, because it is more difficult to make transistors even smaller. Companies are now stacking multiple chips or laying them side by side in a package, connecting them to act as a single piece of silicon.

Where packaging a handful of chips together is now routine, Intel has developed one advanced product that uses new technology to bundle a remarkable 47 individual chips, including some made by TSMC and other companies as well those produced in Intel fabs.

What Makes Chip Factories Different<\/strong>
Intel chips typically sell for hundreds to thousands of dollars each. Intel in March released its fastest microprocessor for desktop computers, for example, at a starting price of $739. A piece of dust invisible to the human eye can ruin one. So fabs have to be cleaner than a hospital operating room and need complex systems to filter air and regulate temperature and humidity.
\"&lt;p&gt;The
The specialized machines that receive pods full of silicon wafers in the making of microchips.<\/span><\/figcaption><\/figure>Fabs must also be impervious to just about any vibration, which can cause costly equipment to malfunction. So fab clean rooms are built on enormous concrete slabs on special shock absorbers.

Also critical is the ability to move vast amounts of liquids and gases. The top level of Intel’s factories, which are about 70 feet tall, have giant fans to help circulate air to the clean room directly below. Below the clean room are thousands of pumps, transformers, power cabinets, utility pipes and chillers that connect to production machines.

The Need for Water<\/strong>
Fabs are water-intensive operations. That’s because water is needed to clean wafers at many stages of the production process.

Intel’s two sites in Chandler collectively draw about 11 million gallons of water a day from the local utility. Intel’s future expansion will require considerably more, a seeming challenge for a drought-plagued state like Arizona, which has cut water allocations to farmers. But farming actually consumes much more water than a chip plant.

Intel says its Chandler sites, which rely on supplies from three rivers and a system of wells, reclaim about 82% of the freshwater they use through filtration systems, settling ponds and other equipment. That water is sent back to the city, which operates treatment facilities that Intel funded, and which redistributes it for irrigation and other nonpotable uses.

Intel hopes to help boost the water supply in Arizona and other states by 2030, by working with environmental groups and others on projects that save and restore water for local communities.
\"&lt;p&gt;Pods
Pods holding up to 25 of the silicon wafers used to make microchips move on automated overhead tracks.<\/span><\/figcaption><\/figure>How Fabs Are Built<\/strong>
To build its future factories, Intel will need roughly 5,000 skilled construction workers for three years.

They have a lot to do. Excavating the foundations is expected to remove 890,000 cubic yards of dirt, carted away at a rate of one dump truck per minute, said Dan Doron, Intel’s construction chief.

The company expects to pour more than 445,000 cubic yards of concrete and use 100,000 tons of reinforcement steel for the foundations — more than in constructing the world’s tallest building, the Burj Khalifa in Dubai, United Arab Emirates.

Some cranes for the construction are so large that more than 100 trucks are needed to bring the pieces to assemble them, Doron said. The cranes will lift, among other things, 55-ton chillers for the new fabs.

Patrick Gelsinger<\/a>, who became Intel’s CEO a year ago, is lobbying Congress to provide grants for fab construction and tax credits for equipment investment. To manage Intel’s spending risk, he plans to emphasize construction of fab “shells” that can be outfitted with equipment to respond to market changes.

To address the chip shortage, Gelsinger will have to make good on his plan to produce chips designed by other companies. But a single company can do only so much; products like phones and cars require components from many suppliers, as well as older chips. And no country can stand alone in semiconductors, either. Though boosting domestic manufacturing can reduce supply risks somewhat, the chip industry will continue to rely on a complex global web of companies for raw materials, production equipment, design software, talent and specialized manufacturing.
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