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<\/span><\/figcaption><\/figure>Taipei: Taiwan Semiconductor Manufacturing Company<\/a> (TSMC<\/a>), the world's largest contract manufacturer for chips, is in early talks with the German government about potentially establishing a plant in the European country.

According to TSMC senior vice president of Europe and Asia sales Lora Ho, various factors like government subsidies, customer demand and the talent pool, would influence its final decision, reports Taipei Times.

In June, TSMC Chairman Mark Liu<\/a> told shareholders that the chipmaker had begun assessments on setting up manufacturing operations in the European country.

TSMC has underway to build up new capacity around the world including a $7 billion semiconductor factory in Japan, as well as a $12 billion facility in Arizona set to start mass production in early 2024.

Meanwhile, TSMC has begun pilot production of 3-nanometer chips, and expects to be producing them in volume at the end of 2022.

TSMC has kicked off pilot production of chips built using N3 (namely 3nm process technology) at its Fab 18 in southern Taiwan.

Currently, Apple<\/a> uses TSMC's 5nm processors for the M1 chips and it is expected that TSMC's 3nm processors will power the next generation of Apple Silicon<\/a>.

Compared with the 5nm process, the 3nm gate-all-around (GAA<\/a>) node boosts performance by 30 per cent, lowers power consumption 50 per cent and takes up 35 per cent less space.
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台积电与德国关于潜在的植物:报告

台湾半导体制造公司(台积电),世界上最大的合同芯片制造商,在早期与德国政府商谈可能在欧洲国家建立工厂。

  • 2021年12月14日更新是中午的12点
阅读: 100年行业专业人士
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台北:台湾半导体制造公司(台积电),世界上最大的合同芯片制造商,在早期与德国政府商谈可能在欧洲国家建立工厂。

根据台积电的高级副总裁何丽梅欧洲和亚洲销售,各种因素如政府补贴,客户需求和人才储备,将影响其最终决定,台北时报报道。

今年6月,台积电董事长马克刘对股东说,芯片制造商已经开始评估建立制造业务在欧洲国家。

台积电已开始建立新的能力在世界各地包括70亿美元的半导体工厂在日本,以及一套价值120亿美元的设施在亚利桑那州在2024年初开始大规模生产。

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与此同时,台积电已经开始试点3毫微米芯片的生产,并期望得到生产体积在2022年底。

台积电已经开始试点生产芯片使用N3(即3 nm制程技术)在其工厂18在台湾南部。

目前,苹果采用台积电的M1 5 nm处理器芯片和预计台积电3 nm处理器将权力的下一代苹果硅。

与5 nm过程相比,3 nm gate-all-around (棉酚)节点通过30%提高性能,降低能耗50%,占用空间少35%。
  • 发布于2021年12月14日11:58点坚持
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\"\"
<\/span><\/figcaption><\/figure>Taipei: Taiwan Semiconductor Manufacturing Company<\/a> (TSMC<\/a>), the world's largest contract manufacturer for chips, is in early talks with the German government about potentially establishing a plant in the European country.

According to TSMC senior vice president of Europe and Asia sales Lora Ho, various factors like government subsidies, customer demand and the talent pool, would influence its final decision, reports Taipei Times.

In June, TSMC Chairman Mark Liu<\/a> told shareholders that the chipmaker had begun assessments on setting up manufacturing operations in the European country.

TSMC has underway to build up new capacity around the world including a $7 billion semiconductor factory in Japan, as well as a $12 billion facility in Arizona set to start mass production in early 2024.

Meanwhile, TSMC has begun pilot production of 3-nanometer chips, and expects to be producing them in volume at the end of 2022.

TSMC has kicked off pilot production of chips built using N3 (namely 3nm process technology) at its Fab 18 in southern Taiwan.

Currently, Apple<\/a> uses TSMC's 5nm processors for the M1 chips and it is expected that TSMC's 3nm processors will power the next generation of Apple Silicon<\/a>.

Compared with the 5nm process, the 3nm gate-all-around (GAA<\/a>) node boosts performance by 30 per cent, lowers power consumption 50 per cent and takes up 35 per cent less space.
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